//
TMAG5170A2QDGKR
HALL EFFECT SENSOR 3D SPI ±300MT 8-VSSOP
Texas Instruments
View in 3D
Want something different?
Bypass caps, pull-ups, strapping resistors, custom silkscreen & more
Design a Custom BoardAbout This Component
High-precision 3D linear Hall-effect sensor with independent X, Y, Z axis measurement for magnetic field detection. Features 20-ksps SPI interface with CRC, integrated temperature sensor (±2°C), and CORDIC angle calculation engine. Supports ±75/±150/±300 mT ranges with ±2.6% maximum measurement error, enabling position sensing applications in motors, actuators, and proximity detection systems.
Package: MSOP-8 · 8 pins
Why does this need a breakout?
The 0.65mm pitch and tiny 3×3mm form factor make hand soldering challenging and impractical for breadboard prototyping. A breakout board converts this compact SMD package into a standard header layout, enabling reliable connections and rapid iteration without specialized soldering equipment or rework risk.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TMAG5170A2QDGKR |
| Package | MSOP-8 |
| Pin Count | 8 |
| Axis | X, Y, Z |
| Bandwidth | 3.5MHz |
| Current - Output (Max) | 2mA |
| Current - Supply (Max) | 245µA |
| Output Type | SPI |
| Voltage - Supply | 2.3V ~ 5.5V |
What's Included
BILL OF MATERIALS
- 1x TMAG5170A2QDGKR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL