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TMAG5170A2QDGKR Breakout
HALL EFFECT SENSOR 3D SPI ±300MT 8-VSSOP
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Design a Custom BoardAbout This Component
High-precision 3D linear Hall-effect sensor with independent X, Y, Z axis measurement for magnetic field detection. Features 20-ksps SPI interface with CRC, integrated temperature sensor (±2°C), and CORDIC angle calculation engine. Supports ±75/±150/±300 mT ranges with ±2.6% maximum measurement error, enabling position sensing applications in motors, actuators, and proximity detection systems.
Package: MSOP-8 · 8 pins
Why does this need a breakout?
The 0.65mm pitch and tiny 3×3mm form factor make hand soldering challenging and impractical for breadboard prototyping. A breakout board converts this compact SMD package into a standard header layout, enabling reliable connections and rapid iteration without specialized soldering equipment or rework risk.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TMAG5170A2QDGKR |
| Package | MSOP-8 |
| Pin Count | 8 |
| Axis | X, Y, Z |
| Bandwidth | 3.5MHz |
| Current - Output (Max) | 2mA |
| Current - Supply (Max) | 245µA |
| Output Type | SPI |
| Voltage - Supply | 2.3V ~ 5.5V |
What's Included
BILL OF MATERIALS
- 1x TMAG5170A2QDGKR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS