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TLV9062IDR
IC OPAMP CMOS DUAL 8SOIC
Texas Instruments
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Design a Custom BoardAbout This Component
Dual CMOS operational amplifier in 8-SOIC package. Features rail-to-rail input and output capability, low power consumption, and high impedance inputs suitable for precision analog signal conditioning. Commonly used in sensor interfaces, audio circuits, and low-power instrumentation applications.
Package: SOIC-8 (3.9×4.9mm) · 8 pins
Why does this need a breakout?
An 8-pin SOIC with 1.27mm pitch is too fine for breadboards and hand-soldering without a microscope. A breakout board routes these pins to standard 0.1" headers, enabling rapid prototyping and reliable connections for op-amps, transceivers, and small power MOSFETs without requiring reflow equipment.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TLV9062IDR |
| Package | SOIC-8 (3.9×4.9mm) |
| Pin Count | 8 |
| Current - Output / Channel | 50 mA |
| Current - Supply | 538µA (x2 Channels) |
| Gain Bandwidth Product | 10 MHz |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 6.5V/µs |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.8 V |
What's Included
BILL OF MATERIALS
- 1x TLV9062IDR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL