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TLV2333IDR
IC OPAMP ZERO-DRIFT DUAL 8-SOIC
Texas Instruments
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Design a Custom BoardAbout This Component
Dual operational amplifier featuring zero-drift architecture with rail-to-rail input and output capability. Offers low offset voltage (<20µV typical), low noise, and high speed performance suitable for precision measurement, signal conditioning, and instrumentation applications requiring minimal offset drift over temperature.
Package: SOIC-8 (3.9×4.9mm) · 8 pins
Why does this need a breakout?
An 8-pin SOIC with 1.27mm pitch is too fine for breadboards and hand-soldering without a microscope. A breakout board routes these pins to standard 0.1" headers, enabling rapid prototyping and reliable connections for op-amps, transceivers, and small power MOSFETs without requiring reflow equipment.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TLV2333IDR |
| Package | SOIC-8 (3.9×4.9mm) |
| Pin Count | 8 |
| Current - Output / Channel | 5 mA |
| Current - Supply | 17µA (x2 Channels) |
| Gain Bandwidth Product | 350 kHz |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 0.16V/µs |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.8 V |
What's Included
BILL OF MATERIALS
- 1x TLV2333IDR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL