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TLP5701(TP,E
OPTOISOLATOR 5KV PUSH-PULL 6-SO
Toshiba Semiconductor and Storage
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Design a Custom BoardAbout This Component
High-speed photocoupler with 5000 Vrms isolation and totem-pole output driver. Features ±0.6A output current, ±20 kV/µs common-mode transient immunity, and 500ns propagation delay. Designed for IGBT and MOSFET gate drive applications in industrial inverters and power conversion circuits operating from -40 to 110°C.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP5701(TP,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Current - DC Forward (If) (Max) | 25mA |
| Current - Output / Channel | 600 mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Push-Pull, Totem Pole |
| Rise / Fall Time (Typ) | 50ns, 50ns |
| Voltage - Forward (Vf) (Typ) | 1.57V |
| Voltage - Isolation | 5000Vrms |
What's Included
BILL OF MATERIALS
- 1x TLP5701(TP,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL