//
TLP292(GB-TPL,E Breakout
OPTOISOLATOR 3.75KV 1CH PHOTOTRANSISTOR 4-SO
View in 3D
Want something different?
Bypass caps, pull-ups, strapping resistors, custom silkscreen & more
Design a Custom BoardAbout This Component
High-isolation photocoupler featuring a phototransistor optically coupled to dual antiparallel infrared LEDs. Provides 3750 Vrms isolation voltage with 50% minimum current transfer ratio and 80V collector-emitter rating. Designed for switching power supplies, PLCs, and I/O interface boards operating from -55°C to 125°C in compact surface-mount applications.
Package: SOIC-4 (4.55×2.6mm) · 4 pins
Why does this need a breakout?
The 1.27mm pin pitch and tiny 4.55×2.6mm form factor make hand-soldering this SOIC nearly impossible without professional equipment. A breakout board converts the fine-pitch pads to through-hole or standard 0.1" spacing, letting you prototype instrumentation amplifiers and optocouplers on breadboards or with conventional soldering tools.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP292(GB-TPL,E |
| Package | SOIC-4 (4.55×2.6mm) |
| Pin Count | 4 |
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50mA |
| Input Type | AC, DC |
| Number of Channels | 1 |
| Output Type | Transistor |
| Rise / Fall Time (Typ) | 2µs, 3µs |
| Voltage - Forward (Vf) (Typ) | 1.25V |
| Voltage - Isolation | 3750Vrms |
What's Included
BILL OF MATERIALS
- 1x TLP292(GB-TPL,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS