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TLP2361(TPL,E
OPTOISOLATOR 3.75KV PUSH-PULL 15MBPS SO6
Toshiba Semiconductor and Storage
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Design a Custom BoardAbout This Component
High-speed optoisolator with infrared LED and integrated photodetector IC, providing 3750V RMS galvanic isolation in a compact SO6 package. Features 15 Mbps data transfer rate, push-pull totem-pole output, and ±20 kV/µs common-mode transient immunity with Faraday shielding. Operates on 2.7–5.5V supply with low 1.0 mA quiescent current, suitable for industrial networking, instrumentation, and digital I/O interfacing applications.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP2361(TPL,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Current - DC Forward (If) (Max) | 10mA |
| Current - Output / Channel | 10 mA |
| Data Rate | 15MBd |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Push-Pull, Totem Pole |
| Rise / Fall Time (Typ) | 3ns, 3ns |
| Voltage - Forward (Vf) (Typ) | 1.5V |
What's Included
BILL OF MATERIALS
- 1x TLP2361(TPL,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL