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TLP172GM(TPL,E
PHOTORELAY SPST-NO 110MA 350V SO6
Toshiba Semiconductor and Storage
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Design a Custom BoardAbout This Component
Optoisolated solid-state relay integrating an infrared LED and photo-MOSFET in a 4-pin SO6 package. Rated for 110 mA maximum on-state current with 350V off-state blocking voltage and 3750 Vrms isolation. Typical applications include battery management systems, factory automation, security systems, and smart meters where space-saving mechanical relay replacements are needed.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP172GM(TPL,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Circuit | SPST-NO (1 Form A) |
| Load Current | 110 mA |
| On-State Resistance (Max) | 50 Ohms |
| Output Type | AC, DC |
| Voltage - Input | 1.27VDC |
| Voltage - Load | 0 V ~ 350 V |
What's Included
BILL OF MATERIALS
- 1x TLP172GM(TPL,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL