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TLP152(TPL,E
OPTOISO 3.75KV 1CH 2.5A TOTEM-POLE SO6
Toshiba Semiconductor and Storage
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Design a Custom BoardAbout This Component
Single-channel photocoupler with 3750 Vrms isolation, featuring a totem-pole output capable of ±2.5 A peak current. Integrates an infrared LED optically coupled to a high-speed photodetector IC with internal shielding for ±20 kV/µs common-mode transient immunity. Designed for direct IGBT and MOSFET gate driving in industrial inverters with propagation delay under 190 ns.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP152(TPL,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Current - DC Forward (If) (Max) | 20 mA |
| Number of Channels | 1 |
| Rise / Fall Time (Typ) | 18ns, 22ns |
| Voltage - Forward (Vf) (Typ) | 1.57V |
| Voltage - Output Supply | 10V ~ 30V |
What's Included
BILL OF MATERIALS
- 1x TLP152(TPL,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL