GVA-63+ Breakout

About This Component

Wideband monolithic RF amplifier fabricated using InGap HBT technology for 0.01–6 GHz operation. Delivers 21 dB gain with ±1.7 dB flatness, +35 dBm IP3, and +19 dBm P1dB at 0.8 GHz. Requires no external matching components and includes integrated ESD protection (Class 1C HBM), making it ideal for base station, CATV, LTE, and wireless infrastructure applications.

Why does this need a breakout?

SOT-89-3 is too small and has leads too close together to hand-solder reliably or plug into breadboards. A breakout board spaces the three pins to standard 0.1" pitch, making it compatible with solderless prototyping and eliminating the need for fine-pitch soldering skills. Essential for rapid development with voltage regulators, transistors, and other common three-terminal devices.

Component specifications

ELECTRICAL CHARACTERISTICS

What's Included

BILL OF MATERIALS

• 1x GVA-63+ soldered onto breakout PCB
• Pin headers pre-soldered (2.54mm / 0.1" pitch)
• All IC pins broken out to 2.54mm headers