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GD25Q128ESIGR
FLASH MEMORY 128MBIT SPI/QUAD 8SOP
GigaDevice Semiconductor (HK) Limited
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Design a Custom BoardAbout This Component
Serial flash memory device with 128 megabit capacity supporting both standard SPI and Quad SPI (QPI) interfaces for high-speed data access. Housed in 8-pin small-outline package suitable for embedded systems, IoT devices, and microcontroller applications requiring non-volatile storage. Typical use includes firmware storage, configuration data, and logging in industrial, automotive, and consumer electronics.
Package: SOICW-8 (5.3mm wide) · 8 pins
Why does this need a breakout?
This SOIC-8 package is too small to hand-solder reliably and incompatible with breadboards. A breakout board brings 1.27mm pitch pins to standard 0.1-inch spacing, enabling prototyping without specialized equipment. Ideal for memory and sensor ICs that demand convenient development while preserving the compact footprint.
Specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | GigaDevice Semiconductor (HK) Limited |
| Part Number | GD25Q128ESIGR |
| Package | SOICW-8 (5.3mm wide) |
| Pin Count | 8 |
| Clock Frequency | 133 MHz |
| Memory Interface | SPI - Quad I/O |
| Memory Size | 128Mbit |
| Voltage - Supply | 2.7V ~ 3.6V |
What's Included
BILL OF MATERIALS
- 1x GD25Q128ESIGR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL