//
TLV9062IDGKR Breakout
IC OPAMP CMOS DUAL 8-VSSOP
View in 3D
Want something different?
Bypass caps, pull-ups, strapping resistors, custom silkscreen & more
Design a Custom BoardAbout This Component
Dual CMOS operational amplifier in 8-pin VSSOP package. Features rail-to-rail input and output operation with low power consumption and high input impedance. Suitable for audio, instrumentation, and general-purpose analog signal conditioning applications requiring compact packaging and minimal current draw.
Package: MSOP-8 · 8 pins
Why does this need a breakout?
The 0.65mm pitch and tiny 3×3mm form factor make hand soldering challenging and impractical for breadboard prototyping. A breakout board converts this compact SMD package into a standard header layout, enabling reliable connections and rapid iteration without specialized soldering equipment or rework risk.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TLV9062IDGKR |
| Package | MSOP-8 |
| Pin Count | 8 |
| Current - Output / Channel | 50 mA |
| Current - Supply | 538µA (x2 Channels) |
| Gain Bandwidth Product | 10 MHz |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 6.5V/µs |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.8 V |
What's Included
BILL OF MATERIALS
- 1x TLV9062IDGKR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL