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TLV9002IDGKR Breakout
OPAMP DUAL RRIO 1MHZ 60UA 8VSSOP
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Design a Custom BoardAbout This Component
Dual-channel rail-to-rail input/output operational amplifier optimized for low-voltage, low-power applications from 1.8V to 5.5V. Features 1 MHz bandwidth, 60 µA quiescent current per channel, and integrated RFI/EMI filtering for robust performance. Ideal for sensor conditioning, current sensing, and battery-powered consumer electronics requiring compact form factors.
Package: MSOP-8 · 8 pins
Why does this need a breakout?
The 0.65mm pitch and tiny 3×3mm form factor make hand soldering challenging and impractical for breadboard prototyping. A breakout board converts this compact SMD package into a standard header layout, enabling reliable connections and rapid iteration without specialized soldering equipment or rework risk.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | TLV9002IDGKR |
| Package | MSOP-8 |
| Pin Count | 8 |
| Current - Output / Channel | 40 mA |
| Current - Supply | 60µA |
| Gain Bandwidth Product | 1 MHz |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 2V/µs |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 1.8 V |
What's Included
BILL OF MATERIALS
- 1x TLV9002IDGKR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL