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TLP5701(D4-TP,E Breakout
OPTOISOLATOR 5KV PUSH-PULL 600MA 6-SO
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£4.89
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Design a Custom BoardAbout This Component
High-speed optoisolator with 5000 Vrms galvanic isolation and integrated photodetector IC in compact 6-pin SO package. Features totem-pole buffer output with ±0.6 A peak current, 500 ns max propagation delay, and ±20 kV/µs common-mode transient immunity. Ideal for IGBT and MOSFET gate drivers in industrial inverters and power conversion applications, rated to 110°C.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP5701(D4-TP,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Current - DC Forward (If) (Max) | 25mA |
| Current - Output / Channel | 600 mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Push-Pull, Totem Pole |
| Rise / Fall Time (Typ) | 50ns, 50ns |
| Voltage - Forward (Vf) (Typ) | 1.57V |
| Voltage - Isolation | 5000Vrms |
| Voltage - Supply | 10V ~ 30V |
What's Included
BILL OF MATERIALS
- 1x TLP5701(D4-TP,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL