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TLP291(GR-TP,SE Breakout
OPTOISOLATOR 3.75KV 1CH PHOTOTRANSISTOR SO4
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£3.47
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Design a Custom BoardAbout This Component
Single-channel optoisolator coupling an infrared LED to a photo transistor with 3750 Vrms isolation voltage. Features 50% minimum current transfer ratio, 80V collector-emitter voltage rating, and wide operating temperature range (-55 to 110°C). Ideal for switching power supplies, PLCs, and I/O interface boards requiring high-density surface mounting in compact SO4 package.
Package: SOIC-4 (4.55×2.6mm) · 4 pins
Why does this need a breakout?
The 1.27mm pin pitch and tiny 4.55×2.6mm form factor make hand-soldering this SOIC nearly impossible without professional equipment. A breakout board converts the fine-pitch pads to through-hole or standard 0.1" spacing, letting you prototype instrumentation amplifiers and optocouplers on breadboards or with conventional soldering tools.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP291(GR-TP,SE |
| Package | SOIC-4 (4.55×2.6mm) |
| Pin Count | 4 |
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Transistor |
| Rise / Fall Time (Typ) | 2µs, 3µs |
| Voltage - Forward (Vf) (Typ) | 1.25V |
| Voltage - Isolation | 3750Vrms |
| Voltage - Output (Max) | 80V |
What's Included
BILL OF MATERIALS
- 1x TLP291(GR-TP,SE soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL