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TLP2355(TPL,E Breakout
OPTOISOLATOR 3.75KV PUSH-PULL SO6
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£4.39
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Design a Custom BoardAbout This Component
High-speed optoisolator with infrared LED coupled to photo detector IC, featuring totem-pole output for both sourcing and sinking current. Provides 3.75 kV RMS isolation with ±20 kV/µs common-mode transient immunity and 250 ns max propagation delay. Suitable for signal isolation in PLCs, intelligent power modules, and high-speed digital instrumentation requiring galvanic isolation.
Package: SO-6 (4.4×3.6mm) · 6 pins
Why does this need a breakout?
SO-6 packages are too small for breadboard prototyping and their 1.27mm pitch makes hand-soldering error-prone. A breakout board brings these pins to standard 0.1" spacing and larger pads, enabling reliable prototyping of compact analog converters and amplifiers without requiring specialized equipment or rework skills.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP2355(TPL,E |
| Package | SO-6 (4.4×3.6mm) |
| Pin Count | 6 |
| Current - DC Forward (If) (Max) | 20mA |
| Current - Output / Channel | 25 mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Push-Pull, Totem Pole |
| Rise / Fall Time (Typ) | 15ns, 12ns |
| Voltage - Forward (Vf) (Typ) | 1.55V |
| Voltage - Isolation | 3750Vrms |
| Voltage - Supply | 3V ~ 20V |
What's Included
BILL OF MATERIALS
- 1x TLP2355(TPL,E soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL