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MCP607T-I/SN Breakout
DUAL CMOS OP-AMP 250µV OFFSET 8-SOIC
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Design a Custom BoardAbout This Component
Dual CMOS operational amplifier featuring low input offset voltage (250 µV max) and rail-to-rail output swing. Operates from 2.5V to 6.0V with minimal quiescent current (25 µA max) and ultra-low input bias current (80 pA). Ideal for battery-powered precision instrumentation, high-impedance sensing, and medical applications.
Package: SOIC-8 (3.9×4.9mm) · 8 pins
Why does this need a breakout?
An 8-pin SOIC with 1.27mm pitch is too fine for breadboards and hand-soldering without a microscope. A breakout board routes these pins to standard 0.1" headers, enabling rapid prototyping and reliable connections for op-amps, transceivers, and small power MOSFETs without requiring reflow equipment.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Microchip Technology |
| Part Number | MCP607T-I/SN |
| Package | SOIC-8 (3.9×4.9mm) |
| Pin Count | 8 |
| Amplifier Type | CMOS |
| Current - Input Bias | 1 pA |
| Current - Output / Channel | 17 mA |
| Current - Supply | 18.7µA (x2 Channels) |
| Gain Bandwidth Product | 155 kHz |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 0.08V/µs |
| Voltage - Input Offset | 250 µV |
| Voltage - Supply Span (Max) | 6 V |
| Voltage - Supply Span (Min) | 2.5 V |
What's Included
BILL OF MATERIALS
- 1x MCP607T-I/SN soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL