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LSF0102DCUR Breakout
IC XLTR VL BIDIR 8-VSSOP
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Design a Custom BoardAbout This Component
Bidirectional voltage-level translator for translating signals between different logic voltage domains. Supports low-voltage CMOS I/O conversion with minimal propagation delay. Ideal for interfacing 3.3V and 5V logic systems, I2C/SPI buses, and mixed-voltage applications requiring minimal board space.
Package: MSOP-8 · 8 pins
Why does this need a breakout?
The 0.65mm pitch and tiny 3×3mm form factor make hand soldering challenging and impractical for breadboard prototyping. A breakout board converts this compact SMD package into a standard header layout, enabling reliable connections and rapid iteration without specialized soldering equipment or rework risk.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Texas Instruments |
| Part Number | LSF0102DCUR |
| Package | MSOP-8 |
| Pin Count | 8 |
| Channels per Circuit | 2 |
| Channel Type | Bidirectional |
| Number of Circuits | 1 |
| Output Type | Open Drain, Push-Pull |
| Voltage - VCCA | 0 V ~ 5 V |
| Voltage - VCCB | 0 V ~ 5 V |
What's Included
BILL OF MATERIALS
- 1x LSF0102DCUR soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL