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TLP185(GRL-TL,SE Breakout
OPTOISO 3.75KV 1CH PHOTOTRANS 6-SOP
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Design a Custom BoardAbout This Component
Single-channel optoisolator with infrared LED coupled to photo transistor, providing 3750 Vrms galvanic isolation. Rated for 80V collector-emitter voltage with 50% minimum current transfer ratio. Housed in compact SO6 package for high-density surface-mount applications in PLCs, AC adapters, and I/O interface boards.
Package: SOP-4 (3.8×4.1mm, P2.54mm) · 4 pins
Why does this need a breakout?
This 4-pin SOP photorelay is too small and tightly pitched (2.54mm) for reliable hand soldering or breadboard use. A breakout board brings the pins to standard 0.1-inch spacing, enabling rapid prototyping of optoisolated switching circuits without the frustration of soldering microscopic leads or dealing with isolation requirements.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP185(GRL-TL,SE |
| Package | SOP-4 (3.8×4.1mm, P2.54mm) |
| Pin Count | 4 |
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Transistor |
| Rise / Fall Time (Typ) | 2µs, 3µs |
| Voltage - Forward (Vf) (Typ) | 1.25V |
| Voltage - Isolation | 3750Vrms |
| Voltage - Output (Max) | 80V |
What's Included
BILL OF MATERIALS
- 1x TLP185(GRL-TL,SE soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS
WIDTH
< 0.9" (straddles breadboard)
PITCH
2.54mm standard
SOLDER
Lead-free, reflow assembled
FINISH
FR4, lead-free HASL