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TLP185(BL-TPL,SE Breakout
OPTOISO 3.75KV 1CH PHOTOTRANS 6-SOP
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Single-channel optocoupler featuring an infrared LED optically coupled to a photo transistor in a compact 6-SOP package. Provides 3750 Vrms isolation voltage with 80V minimum collector-emitter rating and 50% minimum current transfer ratio. Designed for high-density surface-mount applications in PLCs, industrial I/O interfaces, and power supplies requiring galvanic isolation.
Package: SOIC-4 (4.55×2.6mm) · 4 pins
Why does this need a breakout?
The 1.27mm pin pitch and tiny 4.55×2.6mm form factor make hand-soldering this SOIC nearly impossible without professional equipment. A breakout board converts the fine-pitch pads to through-hole or standard 0.1" spacing, letting you prototype instrumentation amplifiers and optocouplers on breadboards or with conventional soldering tools.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP185(BL-TPL,SE |
| Package | SOIC-4 (4.55×2.6mm) |
| Pin Count | 4 |
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50mA |
| Input Type | DC |
| Number of Channels | 1 |
| Output Type | Transistor |
| Rise / Fall Time (Typ) | 2µs, 3µs |
| Voltage - Forward (Vf) (Typ) | 1.25V |
| Voltage - Isolation | 3750Vrms |
| Voltage - Output (Max) | 80V |
What's Included
BILL OF MATERIALS
- 1x TLP185(BL-TPL,SE soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS