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TLP352(TP1,F) Breakout
OPTOISO 3.75KV 1CH GATE DRV 8DIP
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£5.03
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Design a Custom BoardAbout This Component
Single-channel photocoupler with integrated photodetector IC and totem-pole output for galvanic isolation in gate drive applications. Features 3.75 kVrms isolation, ±2.5 A output current capability, ±20 kV/µs common-mode transient immunity, and 200 ns propagation delay. Ideal for IGBT and MOSFET gate drivers in industrial inverters and power conversion circuits, rated -40°C to +125°C.
Package: SOPW-8 (6.605mm wide, P2.54mm) · 8 pins
Why does this need a breakout?
SMD soldering of fine 2.54mm pitch makes hand assembly error-prone and tedious; a breakout board lets you solder once to castellated or standard pads, then prototype freely on breadboard or with thicker wire. Essential for optical isolators, mixed-signal converters, and amplifier ICs where you need reliable connections without rework.
Component specifications
ELECTRICAL CHARACTERISTICS
| Manufacturer | Toshiba Semiconductor and Storage |
| Part Number | TLP352(TP1,F) |
| Package | SOPW-8 (6.605mm wide, P2.54mm) |
| Pin Count | 8 |
| Current - DC Forward (If) (Max) | 20 mA |
| Number of Channels | 1 |
| Rise / Fall Time (Typ) | 15ns, 8ns |
| Voltage - Forward (Vf) (Typ) | 1.55V |
| Voltage - Isolation | 3750Vrms |
| Voltage - Output Supply | 15V ~ 30V |
What's Included
BILL OF MATERIALS
- 1x TLP352(TP1,F) soldered onto breakout PCB
- Pin headers pre-soldered (2.54mm / 0.1" pitch)
- All IC pins broken out to 2.54mm headers
Breakout Board Design
PCB SPECIFICATIONS